Bais, Badariah, Universiti Kebangsaan Malaysia, Malaysia

• Vol 15, No 1: July 2019 - Electronics
  Optimization of KOH etching process for MEMS square diaphragm using response surface method
  Abstract  PDF

This work is licensed under a Creative Commons Attribution-ShareAlike 4.0 International License.

The Indonesian Journal of Electrical Engineering and Computer Science (IJEECS)
p-ISSN: 2502-4752, e-ISSN: 2502-4760
This journal is published by the Institute of Advanced Engineering and Science (IAES) in collaboration with Intelektual Pustaka Media Utama (IPMU).

IJEECS visitor statistics